Saint-Gobain
TEKBOND APAC
CATEGORIES
TEK5778
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
Typical Colors
Yellow transparent particles
Package
25kg
Applications
  • The bonding between plywood, large core board and solid wood. Suitable for cabinets, customized furniture, office furniture, and wooden door seals
Typical Data
  • Viscosity (mPa-s): 15250
    Softening point (°C): 93~103
    Tensile strength (Mpa): 3
    Process Temperature: 170-200°C
Data Download:
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Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • China

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